JPH066530Y2 - プリント配線板 - Google Patents
プリント配線板Info
- Publication number
- JPH066530Y2 JPH066530Y2 JP12812688U JP12812688U JPH066530Y2 JP H066530 Y2 JPH066530 Y2 JP H066530Y2 JP 12812688 U JP12812688 U JP 12812688U JP 12812688 U JP12812688 U JP 12812688U JP H066530 Y2 JPH066530 Y2 JP H066530Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- terminal
- slit
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 34
- 239000004020 conductor Substances 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 13
- 239000003973 paint Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000010019 resist printing Methods 0.000 claims description 4
- 230000000630 rising effect Effects 0.000 claims 1
- 238000007639 printing Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12812688U JPH066530Y2 (ja) | 1988-09-30 | 1988-09-30 | プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12812688U JPH066530Y2 (ja) | 1988-09-30 | 1988-09-30 | プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0249166U JPH0249166U (en]) | 1990-04-05 |
| JPH066530Y2 true JPH066530Y2 (ja) | 1994-02-16 |
Family
ID=31381174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12812688U Expired - Lifetime JPH066530Y2 (ja) | 1988-09-30 | 1988-09-30 | プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH066530Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017212964A1 (ja) * | 2016-06-08 | 2017-12-14 | 三菱電機株式会社 | プリント基板の接続構造 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4552833B2 (ja) * | 2005-11-09 | 2010-09-29 | 船井電機株式会社 | ディスク装置 |
| EP3592120A4 (en) | 2017-03-02 | 2020-03-11 | Mitsubishi Electric Corporation | PRINTED CIRCUIT BOARD |
| EP3780916B1 (en) * | 2018-04-12 | 2025-03-05 | Fuji Corporation | Printed substrate forming method, and printed substrate forming device |
-
1988
- 1988-09-30 JP JP12812688U patent/JPH066530Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017212964A1 (ja) * | 2016-06-08 | 2017-12-14 | 三菱電機株式会社 | プリント基板の接続構造 |
| JPWO2017212964A1 (ja) * | 2016-06-08 | 2019-01-17 | 三菱電機株式会社 | プリント基板の接続構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0249166U (en]) | 1990-04-05 |
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